The BlackStar™ is a Wafer Dicing System utilizing Fantom Wafer Dicing Technology™ (FWDT™)
invented and patented by Fonon Technology International. Solar panels have the highest value
at the dicing stage which is a direct function of the BlackStar™. The BlackStar™ increases the yield per panel and maximizes throughput while minimizing the heat affected zone (HAZ) specifically for solar cells and low-K substrates. This system is used for dicing many semiconductor materials
and silicon composites in solar panel production. The BlackStar™ is the alternative to mechanical
saws which may damage thin and complex solar cell materials and substrates while cutting.